GIGABYTE unveiled its next-generation Intel B860 and AMD B850 motherboards at CES 2025, designed for the latest Intel Core Ultra and AMD Ryzen 9000 series processors, respectively. These new motherboards have enhanced thermal designs to ensure top tier performance.
Similarly to X870 motherboards, the new GIGABYTE Intel B860 and AMD B850 have ultra-durable components and a suite of features for Intel and AMD respectively, including D5 Bionics Corsa. DDR5 memory performance can boost up to 8600MT/s on AMD B850 models and 9466MT/s on Intel B860 motherboards, with help from the AI SNATCH software.
Moreover, the upgraded PCB design ensures low signal reflection for peak performance across multiple layers, thanks to AI simulation. The HyperTune BIOS brings optimizations to fine-tune the memory reference code on Intel B860 series motherboards for high-demand gaming and multitasking. AMD Ryzen 9000 series X3D process can benefit from GIGABYTE’s X3D Turbo feature on AMD B850 motherboards as well.
GIGABYTE B860 and B850 motherboards have an all digital power design and a premium thermal solution with a unique heatsink. The heatsink improves the cooling surface greatly thanks to its included heat pipes and high thermal conductivity pads for supreme cooling efficiency. Moreover, GIGABYTE includes complete DIY-friendly innovations from PCIe EZ-Latch Plus and M.2 EZ-Latch Click to WIFI EZ-PLUG for quick and easy installation.
PC gamers can expect high-end AORUS PRO and ELITE, GIGABYTE GAMING X, and EAGLE models, along with all-white ICE series motherboards with a pure white PCB, memory DIMM slots, PCIe slots, connectors, and a debug port.
